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Chip Scale Package: Design, Materials, Process, Reliability, and Applications 2024 pdf epub mobi 电子书

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发表于2024-11-28

Chip Scale Package: Design, Materials, Process, Reliability, and Applications 2024 pdf epub mobi 电子书

Chip Scale Package: Design, Materials, Process, Reliability, and Applications 2024 pdf epub mobi 电子书

Chip Scale Package: Design, Materials, Process, Reliability, and Applications 2024 pdf epub mobi 电子书

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出版者:McGraw-Hill Professional

作者:John H LauRicky S Lee

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页数:0

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出版时间:1999-02-01

价格:760.8

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isbn号码:9780070383043

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Chip Scale Package: Design, Materials, Process, Reliability, and Applications 2024 pdf epub mobi 电子书图书描述

The first comprehensive, in-depth guide to chip scale packaging, this reference gives you cutting-edge information on the most important new development in electronic packaging since surface mount tec

Chip Scale Package: Design, Materials, Process, Reliability, and Applications 2024 pdf epub mobi 电子书

Chip Scale Package: Design, Materials, Process, Reliability, and Applications 2024 pdf epub mobi 电子书

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Chip Scale Package: Design, Materials, Process, Reliability, and Applications 2024 pdf epub mobi 电子书

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