Nanopackaging

出版者:Springer Verlag

作者:Morris, James E. (EDT)/ Mallik, Debendra (EDT)

页数:568

出版时间:2008-10

价格:$ 190.97

装帧:HRD

isbn号码:9780387473253

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.