System-in-Package RF Design and Applications

出版者:Artech House

作者:Gaynor, Michael P.

页数:221

出版时间:2006-12

价格:$ 111.87

装帧:HRD

isbn号码:9781580539050

图书标签:SiPRF

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In the past few years, System in Package (SiP) design has fueled a revolution in the use of modules in wireless devices due its effectiveness in meeting the increasingly demanding requirements for reliability, shielding, performance, size, and cost. Here's the first comprehensive resource on SiP design techniques that offers designers state-of-the-art packaging know-how. Moreover, the book provides numerous examples that illustrate real-world capabilities, constraints, trade-offs, and options at every step.