Foldable Flex and Thinned Silicon Multichip Packaging Technology 2024 pdf epub mobi 电子书
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发表于2024-11-25
Foldable Flex and Thinned Silicon Multichip Packaging Technology 2024 pdf epub mobi 电子书
Foldable Flex and Thinned Silicon Multichip Packaging Technology 2024 pdf epub mobi 电子书
Foldable Flex and Thinned Silicon Multichip Packaging Technology 2024 pdf epub mobi 电子书
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出版者:Kluwer Academic Pub
作者:Balde, John W. 编
出品人:
页数:368
译者:
出版时间:2003-1
价格:$ 303.97
装帧:HRD
isbn号码:9780792376767
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Foldable Flex and Thinned Silicon Multichip Packaging Technology 2024 pdf epub mobi 电子书 图书描述
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.
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