Fabrication, Packaging and Integration of MEMS and Related Microsystems 2025 pdf epub mobi 电子书


Fabrication, Packaging and Integration of MEMS and Related Microsystems

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发表于2025-01-10

Fabrication, Packaging and Integration of MEMS and Related Microsystems 2025 pdf epub mobi 电子书

Fabrication, Packaging and Integration of MEMS and Related Microsystems 2025 pdf epub mobi 电子书

Fabrication, Packaging and Integration of MEMS and Related Microsystems 2025 pdf epub mobi 电子书



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出版者:
作者:Malshe, Ajay 编
出品人:
页数:500
译者:
出版时间:2012-6
价格:$ 163.85
装帧:
isbn号码:9780387728926
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Fabrication, Packaging and Integration of MEMS and Related Microsystems 2025 pdf epub mobi 电子书 图书描述

This is the first book dedicated to packaging and integration of MEMS and related Microsystems. While packaging was once considered secondary, it has now developed its own standards throughout the world. The book discusses the three key features for next generation application specific systems-on-a-chip (SOC): Mixed Signals, Mixed Environmental Domains, and Varying Scales of Devices and Packaging Components.

Fabrication, Packaging and Integration of MEMS and Related Microsystems 2025 pdf epub mobi 电子书

Fabrication, Packaging and Integration of MEMS and Related Microsystems 2025 pdf epub mobi 电子书
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