Solder Joint Reliability Prediction for Multiple Environments 2024 pdf epub mobi 电子书


Solder Joint Reliability Prediction for Multiple Environments

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发表于2024-07-08

Solder Joint Reliability Prediction for Multiple Environments 2024 pdf epub mobi 电子书

Solder Joint Reliability Prediction for Multiple Environments 2024 pdf epub mobi 电子书

Solder Joint Reliability Prediction for Multiple Environments 2024 pdf epub mobi 电子书



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出版者:
作者:Perkins, Andrew Eugene
出品人:
页数:212
译者:
出版时间:2008-10
价格:$ 168.37
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isbn号码:9780387793931
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Solder Joint Reliability Prediction for Multiple Environments 2024 pdf epub mobi 电子书 图书描述

Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.

Solder Joint Reliability Prediction for Multiple Environments 2024 pdf epub mobi 电子书

Solder Joint Reliability Prediction for Multiple Environments 2024 pdf epub mobi 电子书
想要找书就要到 本本书屋
立刻按 ctrl+D收藏本页
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Solder Joint Reliability Prediction for Multiple Environments 2024 pdf epub mobi 电子书


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