Electronic Packaging Materials and Their Properties 2024 pdf epub mobi 电子书

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发表于2024-10-04

Electronic Packaging Materials and Their Properties 2024 pdf epub mobi 电子书

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出版者:CRC Press

作者:Michael Pecht

出品人:

页数:128

译者:

出版时间:1998-12-18

价格:USD 133.95

装帧:Hardcover

isbn号码:9780849396250

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Electronic Packaging Materials and Their Properties 2024 pdf epub mobi 电子书图书描述

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. "Electronic Packaging Materials and Their Properties" examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections; printed circuit boards; substrates; encapsulants; dielectrics; die attach materials; electrical contacts; thermal materials; and, solders."Electronic Packaging Materials and Their Properties" also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

Electronic Packaging Materials and Their Properties 2024 pdf epub mobi 电子书

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