发表于2024-06-26
Area Array Packaging Handbook: Manufacturing and Assembly 2024 pdf epub mobi 电子书
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*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC)~*Details the pro
Area Array Packaging Handbook: Manufacturing and Assembly 2024 pdf epub mobi 电子书