*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC)~*Details the pro
發表於2024-11-16
Area Array Packaging Handbook: Manufacturing and Assembly 2024 pdf epub mobi 電子書 下載
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Area Array Packaging Handbook: Manufacturing and Assembly 2024 pdf epub mobi 電子書 下載