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Integrated Circuit Packaging, Assembly and Interconnections 2024 pdf epub mobi 电子书

Integrated Circuit Packaging, Assembly and Interconnections
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发表于2024-11-14

Integrated Circuit Packaging, Assembly and Interconnections 2024 pdf epub mobi 电子书

Integrated Circuit Packaging, Assembly and Interconnections 2024 pdf epub mobi 电子书

Integrated Circuit Packaging, Assembly and Interconnections 2024 pdf epub mobi 电子书


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出版者:Springer Verlag
作者:Greig, William J.
出品人:
页数:328
译者:
出版时间:2007-3
价格:$ 179.67
装帧:HRD
isbn号码:9780387281537
丛书系列:

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Integrated Circuit Packaging, Assembly and Interconnections 2024 pdf epub mobi 电子书 图书描述

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.

Integrated Circuit Packaging, Assembly and Interconnections 2024 pdf epub mobi 电子书
Integrated Circuit Packaging, Assembly and Interconnections 2024 pdf epub mobi 电子书
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Integrated Circuit Packaging, Assembly and Interconnections 2024 pdf epub mobi 电子书

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